GT100AH-PA（平面式高速固晶机）
（周期：50ms）
适用于2121,3014及2835,5050等
一、机型特性
1.采用国际领先的双固晶，双点胶，双晶片搜寻系统；
2.采用直驱电机驱动邦头；
3.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）
4.晶框采用自动角度修正系统；
5.采用可程式恒温点胶系统；
6.采用真空漏晶检测；
7.采用自动式装卸晶环系统、支架采用叠片式上料（免装料盒），有效提高了生产效率；
8.工控机控制设备运行，简化了自动化设备的操作；
9.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
10.精准的固晶位置及优良的一致性为后道工序提供了先天的保障。
GT100AH-PA
Plane-type High-speed Die Bonder
Cycle: 50ms
It is compatible with 2121、3014、2835 and 5050 etc.
Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Automatic chip theta alignment system is applied on the Crystal frame;
5. Programmed control constant-temperature adhesive dispensing system is also applied;
6. Vacuum die missing testing technology is adopted;
7. Automatic installing & uninstalling crystal rings and stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely;
8. IPC will control the operation of equipment, simplifying the operation of automation equipment;
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.
二、规格参数
Specifications and Parameters
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1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
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生产周期/Production Cycle |
50ms 周期取决于晶片尺寸及支架(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
90°可旋转固晶(Rotatable Die Bond) |
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XY位置精度/Accuracy |
±1mil(±0.025mm） |
吸晶压力/Die Bond Pressure |
可调20g—250g(Adjustable) |
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芯片旋转/Die Rotation |
±1° |
5.送料工作平台/Loading Workbench |
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2.芯片XY工作台/Die XY Workbench |
行程范围/Range of Stroke |
170mm*75mm |
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芯片尺寸/Die Dimensions |
3mil×3mil-80mil×80mil |
XY分辨率/XY Resolution |
0.02mil(0.5μm) |
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6.适用支架尺寸/Suitable Holder’s Size |
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晶片最大角度修正/Max.Angle Correction |
±15° |
支架长度/Length |
120mm ~ 170mm |
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最大芯片环尺寸/Max.Die Ring Size |
6″（152mm）外径(External Diameter) |
支架宽度/Width |
48mm~ 75mm |
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最大芯片面积尺寸/Max.Die Area |
4.7″（119mm）扩张后(Expanded) |
7.所需设施/Facilities Needed |
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分辨率/Resolution Ratio |
0.04mil (1μm) |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
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顶针Z高度行程/Thimble Z Height Stroke |
80mil（2mm） |
压缩空气/Compressed Air |
0.5MPa（MIN） |
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额定功率/Rated Power |
950W |
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3.图像识别系统/Image Recognition System |
耗气量/Gas Consumption |
5L/min |
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灰阶度/Grey Scale |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
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分辨率/Resolution |
656×492像素(Pixels) |
长x宽x高/Length x Width x Height |
170×100×180cm |
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图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
1200kg |
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